INDUSTRIAL APPLICATION I CAN GIVE EVERYTHING YOU WANT.
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Official Website of Mobile Phone
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0563-6725566 -
Online consultation
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THE PROTECTION OF WAFER CUTTING
UV tape is specially designed for wafer grinding, cutting, load-bearing processing of fine electronic parts, and processing and cutting of small parts of various materials; coated with special adhesive, with high adhesion, can be cut with super adhesion T
SOLVE THE PAIN POINT
High adhesion, no chip scattering, no glue residue
APPLICATION CASE